PCB Production Process;

MAYA PROJECT ELECTRONICS meticulously manages the PCB production process using state-of-the-art equipment in its modern facilities. Our production process consists of the following steps:

1.Design and Engineering: PCB design and engineering work is carried out based on design files provided by the customer. Customized PCB design and prototyping services are provided according to customer requirements.

2.Panelization and Film Production: PCBs are divided into groups of specific sizes in the panelization step, and then placed on glass plates used for film production.

3.Printing and Exposure: PCB design is printed onto the printing plate to create circuit traces. Subsequently, the circuit traces are exposed to UV light in the exposure process.

4.Chemical Processes: Chemical baths are used to remove unnecessary metal particles from the exposed PCB plates and to make the circuit traces more distinct.

5.Drilling and Processing: Drilling machines are used to drill mounting holes and connection points on PCB plates. Then, the PCB plates are cut to the desired size and their edges are processed.

6.Surface Coating: PCB plates undergo the desired surface coating process to provide protection and conductivity. This process is usually carried out using methods such as soldering or gold plating.

7.Testing and Quality Control: The produced PCBs undergo strict testing and quality control procedures. This step ensures the detection and rectification of any defects, thereby ensuring the delivery of the highest quality products to customers.

Our Machinery Facility

Our company operates on an area of 300 square meters, with 350 square meters dedicated to production, including both SMD and THT lines. All our units operate in compliance with lead-free production (RoHS) and REACH criteria. The floor of our production area is covered with ESD-protected PVC, suitable for electronic board manufacturing.

Machine Specifications

*Optimal capacity: 56,000 components/hour/2 x gantry, 12 placement heads

*Each placement head is multi-functional and capable of placing fine-pitch components. (In some competitor models, only one or two placement heads can place fine-pitch components.)

*Feeder capacity is 120 units, and 112 units in DC models.

*Offers flexibility with different conveyor models such as 1+1+1, 1+2+1, 1+2+2, 2+2+2, and 2+2+1.

*Standard configuration is provided with a 1+2+1 conveyor type.

*Features user-friendly software and automatic conveyor adjustment.

*Equipped with mega pixel cameras on the placement head, offering precise placement capability at 1,360 x 1,040 pixels.

*With fly-camera technology on the head, it can place all chips, ICs, BGAs, and micro BGAs up to 16 x 16 mm in size and 10 mm in height.

*Provides operational ease with non-stop component identification.

*With the polygon function automatic component recognition feature, it can complete the component recognition process, which can take up to 2 hours, in just 30 seconds.

*Continuously monitors feeder pick-up positions.

*Features an automatic nozzle changing station and a special vacuum system to prevent nozzle contamination.

*Capable of high-speed component placement from 01005 inches to 0.3mm pitch BGA, micro BGA, QFN, CSP, SMD connectors, and components.

*When using a fixed camera, it can place any component up to 55 x 55 mm in size and connectors up to 75 mm in length.

*With a fixed camera, the component height is 25 mm.

*Standard PCB size: 510 x 460 mm.

*Max. placement length is 1200 x 460 mm.